HI-1575
THERMAL CHARACTERISTICS
Data taken at VDD = 3.3V, continuous data transmission at 1 Mbit/s, single transmitter enabled.
JUNCTION TEMPERATURE
PART NUMBER
PACKAGE STYLE
CONDITION
qJA
TA= 25°C TA= 85°C TA= 125°C
Mounted on
circuit board
59.5
°C / W
32 pin PQFP
40 pin LPCC
HI-1575PQI / T
HI-1575PCI / T
TBD°C
TBD°C
TBD°C
TBD°C
TBD°C
TBD°C
Heat sink pad
soldered
27.5
°C / W
ORDERING INFORMATION
HI - 1575 xx x x
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
100ꢀ Matte Tin (Pb-free, RoHS compliant)
Blank
F
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
I
NO
NO
T
M
T
M
YES
PART
NUMBER
PACKAGE
DESCRIPTION
PQ
PC
32 PIN PLASTIC PQFP
40 PIN CHIP SCALE PACKAGE (PCM not available)
HOLT INTEGRATED CIRCUITS
11
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
