PACKAGE DIMENSIONS
inches (millimeters)
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.0105 ± .0015
(.2667 ± .0381)
Heat sink stud on
bottom of package.
Package Type: 24HEW
.5035 ± .0075
(12.789 ± .191)
.300
TYP.
(7.620)
.025
Min..
(.635)
.4065 ± .0125
(10.325 ± .318)
Top View
.296 ± .003
(7.518 ± .076)
.215
TYP.
(5.461)
Bottom
View
.018
TYP.
(.457)
SEE DETAIL A
.025
Min..
(.635)
.090 ± .010
(2.286 ± .254)
0° to 8°
.050
TYP
(1.27)
.033 ± .017
(.838 ± .432)
DETAIL A
.0075 ± .0035
(.191 ± .889)
20-PIN CERAMIC SIDE-BRAZED DIP
P
ACKAGE
T
YPE
: 20C
1.000
±
.010
(25.400
±
.254)
.310
±
.
010
(7.874
±
.254)
.050 TYP.
(1.270 TYP.)
.200 MAX.
(5.080 MAX.)
.085
±
.009
(2.159
±
.229)
.300
±
.
010
(7.620
±
.254)
.125 MIN.
(3.175 MIN.)
.017
±
.002
(.432
±
.051)
.100
±
.005
(2.540
±
.127)
.010
+.002/-
.001
(.254
+.051/-
.025)
HOLT INTEGRATED CIRCUITS
9
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
