HI-1567, HI-1568
Point
“A
T
”
TRANSMITTER
TXA/B
TXA/B
TXINHA/B
52.5
W
(.75 Zo)
35
W
(.5 Zo)
52.5
W
(.75 Zo)
BUSA/B
1:1.79
1:1.4
52.5
W
(.75 Zo)
35
W
(.5 Zo)
BUSA/B
Isolation
Transformer
Point
“A
T
”
1.79:1
Coupling
Transformer
52.5
W
(.75 Zo)
1.4:1
RECEIVER
RXA/B
RXA/B
Coupling
Transformer
Isolation
Transformer
RXENA/B
Figure 3. Transformer Coupled Test Circuits
HEAT SINK - ESOIC PACKAGE
Both the HI-1567PSI/T and HI-1568PSI/T use a 20-pin
thermally enhanced SOIC package. The package
includes a metal heat sink located on the bottom surface
of the device. This heat sink should be soldered down to
the printed circuit board for optimum thermal dissipation.
The heat sink is electrically connected to the VDD supply
of the chip and therefore must be isolated from all other
signals.
THERMAL CHARACTERISTICS
PART NUMBER
HI-1567PSI / T / M
HI-1568PSI / T / M
HI-1567CDI / T / M
HI-1568CDI / T / M
HI-1567PCI / T
HI-1568PCI / T
PACKAGE STYLE
CONDITION
Heat sink
unsoldered
Heat sink
soldered
Socketed
Heat sink
unsoldered
Ø
JA
54°C/W
47°C/W
62°C/W
49°C/W
JUNCTION TEMPERATURE
T
A
=25°C
62°C
57°C
69°C
59°C
T
A
=85°C T
A
=125°C
122°C
117°C
129°C
119°C
162°C
157°C
169°C
159°C
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
20-pin Ceramic
side-brazed DIP
44-pin Plastic chip-
scale package
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
RADIATION TOLERANCE
The HI-1567 has been characterized for total dose
radiation performance in accordance with MIL-STD-883
method 1019. The part meets all data sheet parameters
after exposure to 25 KRad(Si).
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
HOLT INTEGRATED CIRCUITS
6
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
