HT46R46E/C46E/R47E/C47E/R48AE/C48AE/R49E
Configuration
Option
Pin Name
I/O
Description
Bidirectional 2-bit input/output port. Software instructions determine if the pin
is a CMOS output or Schmitt Trigger input. Configuration option determines if
PD0/PWM0
PD1/PWM1
Pull-high
I/O
I/O or PWM this pin has a pull-high resistor. The PWM output are pin-shared with pins
PD0 and PD1 selected via a configuration option.
OSC1, OSC2 are connected to an external RC network or external crystal,
OSC1
OSC2
I
determined by configuration option, for the internal system clock. If the RC
Crystal or RC
O
system clock option is selected, pin OSC2 can be used to measure the sys-
tem clock at 1/4 frequency.
RES
VDD
VSS
I
Schmitt Trigger reset input. Active low.
Positive power supply
¾
¾
¾
¾
¾
Negative power supply, ground
Note: 1. Each pin on PA can be programmed through a configuration option to have a wake-up function.
2. Individual pins can be selected to have a pull-high resistor.
3. Pins PC2~PC4 and pin PD1/PWM1 exist but are not bonded out on the 24-pin package.
4. Unbonded pins should be setup as outputs or as inputs with pull-high resistors to conserve power.
Absolute Maximum Ratings
Supply Voltage...........................VSS-0.3V to VSS+6.0V
Input Voltage..............................VSS-0.3V to VDD+0.3V
Storage Temperature............................-50°C to 125°C
Operating Temperature...........................-40°C to 85°C
IOH Total............................................................-100mA
I
OL Total ..............................................................150mA
Total Power Dissipation .....................................500mW
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Ta=25°C
Test Conditions
Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VDD
¾
fSYS=4MHz
2.2
3.3
¾
5.5
5.5
1.5
4
V
¾
¾
VDD
Operating Voltage
fSYS=8MHz
V
¾
3V
5V
3V
5V
0.6
2
mA
mA
mA
mA
No load, fSYS=4MHz
ADC disable
IDD1
Operating Current (Crystal OSC)
Operating Current (RC OSC)
¾
0.8
2.5
1.5
4
¾
No load, fSYS=4MHz
ADC disable
IDD2
IDD3
ISTB1
¾
Operating Current
No load, fSYS=8MHz
ADC disable
5V
4
8
mA
¾
(Crystal OSC, RC OSC)
3V
5V
3V
5V
5
10
1
¾
¾
¾
¾
¾
¾
¾
¾
mA
mA
mA
mA
No load,
Standby Current (WDT Enabled)
Standby Current (WDT Disabled)
system HALT
No load,
ISTB2
system HALT
2
Input Low Voltage for I/O Ports,
TMR and INT
VIL1
0.3VDD
0
V
¾
¾
¾
Input High Voltage for I/O Ports,
TMR and INT
VIH1
VIL2
0.7VDD
0
VDD
V
V
¾
¾
¾
¾
¾
¾
0.4VDD
Input Low Voltage (RES)
Rev. 1.30
5
December 19, 2007
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
