HT36A4
Pad Coordinates
Unit: mm
Pad No.
X
Y
Pad No.
X
Y
1
2
3
4
5
6
7
8
9
1096.250
985.650
10
11
12
13
14
15
16
17
900.650
900.650
901.625
901.625
697.050
586.450
-588.250
-698.850
-903.425
-903.425
-882.900
-882.900
-831.950
-831.950
-177.390
-65.590
-994.626
-316.774
1006.000
1116.600
1114.025
1114.025
1114.025
1114.025
-650.050
-776.910
-886.910
-1025.350
-1045.600
-1045.600
-1107.950
900.650
Pad Description
Internal
Connection
Pad Name I/O
Function
Pull-High
or None
PA0~PA7
I/O
Bidirectional 8-bit Input/Output port, wake-up by mask option
VSSA
VSS
Negative power supply of DAC, ground
Negative power supply, ground
Positive power supply
¾
¾
¾
¾
¾
O
¾
¾
¾
¾
¾
¾
¾
VDD
VDDA
TEST
AUD
DAC power supply
No connection (open)
Audio output for driving a external transistor or for driving HT82V733
Reset input, active low
RES
I
OSC1 and OSC2 are connected to an RC network or a crystal (by mask option)
for the internal system clock. In the case of RC operation, OSC2 is the output ter-
minal for 1/4 system clock (fOSC2=fOSC/8). The system clock may come from the
crystal, the two pins cannot be floating.
OSC1
OSC2
I
¾
O
Absolute Maximum Ratings
Supply Voltage ......................... VSS-0.3V to VSS+5.5V
Input Voltage ............................ VSS-0.3V to VDD+0.3V
Storage Temperature .......................... -50°C to 125°C
Operating Temperature ....................... -40°C to 85°C*
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
* ROSC=Metal resistor or crystal
Rev. 1.10
3
March 12, 2007
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
