HT24LC16
Carrier Tape Dimensions
P
0
P
1
t
D
E
F
W
B
0
C
D
1
P
K
0
A
0
R
e
e
l
H
o
l
e
I
C
p
a
c
k
a
g
e
p
i
n
1
a
n
d
t
h
a
r
e
l
o
c
a
t
e
d
o
n
t
h
e
s
a
m
e
SOP 8N
Symbol
Description
Dimensions in mm
12.0+0.3/-0.1
W
P
Carrier Tape Width
Cavity Pitch
8.0±0.1
1.75±0.1
5.5±0.1
E
Perforation Position
F
Cavity to Perforation (Width Direction)
Perforation Diameter
Cavity Hole Diameter
Perforation Pitch
D
1.55±0.10
1.50+0.25
4.0±0.1
D1
P0
P1
A0
B0
K0
t
Cavity to Perforation (Length Direction)
Cavity Length
2.0±0.1
6.4±0.1
Cavity Width
5.2±0.1
Cavity Depth
2.1±0.1
Carrier Tape Thickness
Cover Tape Width
0.30±0.05
9.3±0.1
C
TSSOP 8L
Symbol
Description
Carrier Tape Width
Dimensions in mm
12.0+0.3/-0.1
W
P
Cavity Pitch
8.0±0.1
1.75±0.10
5.5±0.5
E
Perforation Position
Cavity to Perforation (Width Direction)
Perforation Diameter
Cavity Hole Diameter
Perforation Pitch
F
D
1.5+0.1/-0.0
1.5+0.1/-0.0
4.0±0.1
D1
P0
P1
A0
B0
K0
t
Cavity to Perforation (Length Direction)
Cavity Length
2.0±0.1
7.0±0.1
Cavity Width
3.6±0.1
Cavity Depth
1.6±0.1
Carrier Tape Thickness
Cover Tape Width
0.300±0.013
9.3±0.1
C
Rev. 1.60
11
June 25, 2010
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
