HT10XX
Pad Assignment
Pad No.
1
2
3
Chip size: 76
×
50 (mil)
2
*The IC substrate should be connected to VDD in the PCB layout artwork.
Unit:mil
X
–28.2
–7.55
–30.1
Y
16.6
16.7
16.6
Block Diagram
Absolute Maximum Ratings
Supply Voltage ............................... –0.3V to 13V
Power Dissipation...................................250mW
Storage Temperature................. –50
°
C to 125
°
C
Operating Temperature................... 0
°
C to 70
°
C
2
3rd Oct ’96