HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Outline Drawing
7
Die Packaging Information
[1]
Standard
Gp-5 (Gel-pak®)
Alternate
[2]
NOteS:
1. DiMeNSiONS iN iNcheS [MiLLiMeteRS].
2. Die thicKNeSS iS 0.005”.
3. tYpicAL BOND pAD iS 0.004” SQUARe.
4. tYpicAL BOND pAD SpAciNG iS 0.006” ceNteR tO ceNteR.
5. BOND pAD MetALLiZAtiON: GOLD.
6. pADS 4 AND 6 MUSt Be cONNecteD tO RF/Dc GROUND.
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Pad Descriptions
pad Number
Function
Description
interface Schematic
1, 7
A, A (alt.)
See truth table and control voltage table.
connect either pad 1 or pad 7 to control logic input.
2, 5, 8
RF1, RFc, RF2
these pads are Dc coupled and matched to 50 Ohms.
Blocking capacitors are required.
3, 9
B, B (alt.)
See truth table and control voltage table.
connect either pad 3 or pad 9 to control logic input.
4, 6
Ac GND
Must be connected to RF/Dc ground.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
7-4
SwitcheS - chip
HITTITE [ HITTITE MICROWAVE CORPORATION ]
