HMC203_09 参数 Datasheet PDF下载

HMC203

v03.1007

GaAs MMIC DOUBLE-BALANCED

MIXER, 14 - 23 GHz

Pad Descriptions

Pad Number

Function

Description

Interface Schematic

1

RF

This pin is AC coupled

and matched to 50 Ohms.

2

LO

This pin is AC coupled

and matched to 50 Ohms.

4

MIXERS - DOUBLE-BALANCED - CHIP

4 - 35

3

IF

This pin is DC coupled. For applications not requiring operation to

DC, this port should be DC blocked externally using a series capacitor

whose value has been chosen to pass the necessary IF frequency

range. For operation to DC, this pin must not source/sink more than 2

mA of current or die non-function and possible die failure will result.

Die bottom must be connected to RF/DC ground.

Die Bottom

GND

Handling Precautions

Follow these precautions to avoid permanent damage.

Storage:

All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag

for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.

Cleanliness:

Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.

Static Sensitivity:

Follow ESD precautions to protect against ESD strikes.

Transients:

Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize

inductive pick-up.

General Handling:

Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the

chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.

Mounting

The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting

surface should be clean and flat.

Eutectic Die Attach:

A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature

of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip

to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for

attachment.

Epoxy Die Attach:

Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the

perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.

Wire Bonding

RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of

40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made

with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150

°C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible,

less than 12 mils (0.31 mm).

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com