HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage:
All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed
in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die
should be stored in a dry nitrogen environment.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid
cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent
tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum
collet, tweezers, or fingers.
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2 - 21
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically con-
ductive epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage tem-
perature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds
should be started on the chip and terminated on the package. RF bonds should be as short as possible.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HITTITE [ HITTITE MICROWAVE CORPORATION ]
