'9
9
HMC165S14
MICROWAVE CORPORATION
ne
w
!
HMC165S14 SP4T SWITCH DC TO 2.0 GHz
V
01.0101
F
EBRUARY
2001
Outline
PIN 14
GND RF2
A
0.337/0.344
(8.55/8.75)
B
Vee
RF3 GND
COUNTRY OF ORIGIN
0.150/0.157
(3.81/4.00)
HMC165S14
GND RF1
GND RFC
GND
RF4 GND
0.229/0.244
(5.82/6.20)
CCCC
XXXXX
YYWW
LOT NUMBER
DATE CODE
YY= YEAR
WW= WEEK
PIN 1
PIN 1 (REF)
0.054/0.068
(1.37/1.73)
0.050
(1.27)
TYP
3 DEG/8 DEG
0.014/0.018
(0.36/0.46)
TYP
0.004/0.009
(0.10/0.23)
0.007/0.009
(0.18/0.25) TYP
0.016
(0.41) MIN TYP
1)
TTL Interface Circuit
Vcc
TTL Control A
5.1V
Zener
To A
74HCT04 (1/6)
10K Vee
Ohm
-5 VDC
Vcc
TTL Control B
To B
5.1V
Zener
74HCT04 (1/6)
10K Vee
Ohm
-5 VDC
Note:
Control inputs A and B can be driven directly with TTL
logic with -5 Volts applied to the HCT logic gates (Vee) and to Vee (pin 10) of the RF switch.
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
7 - 25
SMT
SP4T
S
WITCHES
2.
3.
MATERIAL:
A) PACKAGE BODY LOW STRESS INJECTION MOLDED PLASTIC, SILICA & SILICONE IMPREGNATED
B) LEADFRAME MATERIAL: COPPER ALLOY
PLATING: LEAD-TIN SOLDER PLATE
DIMENSIONS ARE IN INCHES (MILLIMETERS) UNLESS OTHERWISE SPECIFIED TOL. ARE ±0.005(±0.13)
7
HITTITE [ HITTITE MICROWAVE CORPORATION ]
