HMC129
v04.1007
GaAs MMIC DOUBLE-BALANCED
MIXER, 4 - 8 GHz
Absolute Maximum Ratings
LO Drive
+27 dBm
-65 to +150 °C
-55 to +85 °C
MxN Spurious @ IF Port
nLO
mRF
0
1
2
3
4
0
xx
8.16
78.5
76.0
73.83
1
13.66
0
80.16
80.0
77.83
2
26.83
31.33
75.16
81.16
80.0
3
9.16
49.33
79.16
64.5
81.83
4
38.33
43.5
76.66
78.66
82.0
Storage Temperature
Operating Temperature
RF Freq. = 6.1 GHz @ -10 dBm
LO Freq. = 6.0 GHz @ +13 dBm
Measured as downconverter
4
MIXERS - DOUBLE-BALANCED - CHIP
Outline Drawing
Die Packaging Information
[1]
Standard
WP-3 (Waffle Pack)
Alternate
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER
.1 IS .006” EXCEPT AS SHOWN
4. DIE THICKNESS = .004” [.100 MM]
5. BACKSIDE METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HITTITE [ HITTITE MICROWAVE CORPORATION ]
