The XENSIV™ TLE4999I3 provides all means that are necessary to fulfill the state-of-the-art functional safety requirements on system level. It is developed in full compliance with ISO 26262. The device provides high redundancy on one chip by means of two sensor elements included within one monolithic silicon design. The two diverse Hall sensor elements („main” and „sub”) have internally separated signal paths within the chip. A plausibility check secures the high diagnostic coverage required for premium functional safety compliant systems up to ASIL-D.
Infineon’s OptiMOS™ 5 80V n-channel power MOSFET IPT019N08N5 in TO-Leadless package is ideally suited for high switching frequencies. This package is especially designed for high current applications such as forklift, light electric vehicles (LEV), POL (point-of-load) and telecom. With a 60% space reduction compared to D2PAK 7pin package, TO-Leadless (TOLL) is the perfect solution where highest efficiency, outstanding EMI behavior as well as best thermal behavior and space reduction are required.
