5.0 mm
FORMED LEAD
DIA LED
LAMP
REV:A / 0
520PG2C-F2
should be performed with base fixed means of a jig or pliers (Fig.7)
1) The lead should be bent at a point located at least 2mm away from the package. Bending
F i g . 7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
LEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
DRAWING NO. : DS-35-08-0395
2 m m
DATE : 2008-12-24
Page :8
HB [ HB ELECTRONIC COMPONENTS ]
