5.0 mm DIA LED LAMP
520LB7C-F2
REV:A / 1
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
y Using soldering flux,” RESIN FLUX”
DIP
SOLDERING
Bath temperature: 260℃
Immersion time: with 5 sec,1 time
is recommended.
yAttached data of temperatuare cure
for your reference
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
T
emperature at tip of iron: 360℃ or lower (To prevent heat from being Soldering time: within 3 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave a slight
clearance
(Fig.2)
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3
seconds.
DRAWING NO. : DS-35-07-0016
DATE : 2008-12-24
Page : 5
HB [ HB ELECTRONIC COMPONENTS ]
