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HS1-1840RH-8 参数 Datasheet PDF下载

HS1-1840RH-8图片预览
型号: HS1-1840RH-8
PDF下载: 下载PDF文件 查看货源
内容描述: 抗辐射16通道CMOS模拟抗辐射16通道CMOS模拟 [Rad-Hard 16 Channel CMOS Analog Rad-Hard 16 Channel CMOS Analog]
分类和应用:
文件页数/大小: 13 页 / 194 K
品牌: HARRIS [ HARRIS CORPORATION ]
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HS-1840RH  
Harris - Space Level Product Flow  
SEM - Traceable to Diffusion Method 2018, Modified  
Room Temperature Electrical Tests (T1)  
This device does not meet MIL-STD-883 Method 2018.3 Class Burn-In Delta Calculation (T0-T1)  
S minimum metal step coverage of 50%. The metal does meet  
PDA Calculation 3% Functional  
5% Subgroups 1, 7, ∆  
Dynamic Burn-In 240 Hours at +125oC or equivalent  
the intent of the Class S requirement by meeting the current  
density requirement of <2E5 A/cm2. Calculation based on con-  
tinuous current of 10mA. Data can be provided upon request.  
Method 1015 Condition A  
Wafer Lot Acceptance Method 5007  
Electrical Tests Subgroups 1, 7, 9 (T2)  
Burn-In Delta Calculation (T0 - T2)  
Internal Visual Inspection (Note 1)  
Gamma Radiation Assurance Tests Method 1019  
100% Nondestructive Bond Pull Method 2023  
Customer Pre-Cap Visual Inspection (Notes 1, 2)  
Temperature Cycling Method 1010 Condition C  
Constant Acceleration Method 2001 Y1 30KG  
PDA Calculation 3% Functional  
5% Subgroups 1, 7, ∆  
Electrical Test +125oC, -55oC  
Alternate Group A Inspection Method 5005  
Fine and Gross Leak Tests Method 1014  
Customer Source Inspection (Note 2)  
Group B Inspection (Notes 2, 4) Method 5005  
Group D Inspection (Notes 2, 4) Method 5005  
External Visual Inspection Method 2009  
Data Package Generation (Note 3)  
Particle Impact Noise Detection Method 2020,  
Condition A 20G  
Marking and Serialization  
X-Ray Inspection Method 2012  
Initial Electrical Tests (T0)  
Static Burn-In 72 Hour, +125oC (Min) Method 1015  
Condition A  
NOTES:  
1. Visual Inspection is performed to MIL-STD-883 Method 2010, Condition A.  
2. These steps are optional, and should be listed on the purchase order if required.  
3. Data package contains: Assembly Attributes (post seal)  
o
o
o
Test Attributes (includes Group A) -55 C, +25 C, +125 C  
Shippable Serial Number List  
Radiation Testing Certificate of Conformance  
Wafer Lot Acceptance Report (includes SEM report)  
X-Ray Report and Film  
Test Variables Data, (Table 5 Parameters only)  
o
+25 C Initial Test  
o
+25 C Interim Test 1  
o
+25 C Interim Test 2  
o
+25 C Delta Over Burn-In  
4. Group B data package contains Attributes Data and Variables Data, (Table 5 Parameters only). Group D data package contains Attributes only.  
Harris -8 Product Flow  
Internal Visual Inspection, Alternate Condition B (Note 1)  
Gamma Radiation Assurance Tests Method 1019  
Customer Pre-Cap Visual Inspection (Notes 1, 2)  
Temperature Cycling Method 1010 Condition C (50 Cycles)  
Constant Acceleration Method 2001 Y1 30kG  
Fine and Gross Leak Tests Method 1014  
Marking  
Electrical Tests Subgroups 1, 7, 9 (T1) Method 5004  
PDA Calculation 5% Subgroups 1, 7 Method 5004  
Electrical Test +125oC, -55oC Method 5004  
Alternate Group A Inspection Method 5005  
Customer Source Inspection (Note 2)  
Group B Inspection (Notes 2, 4) Method 5005 (Optional)  
Group C Inspection (Notes 2, 4) Method 5005 (Optional)  
Group D Inspection (Notes 2, 4) Method 5005 (Optional)  
External Visual Inspection Method 2009  
Initial Electrical Tests (T0)  
Dynamic Burn-In 160 Hours, +125oC Method 1015 or  
Equivalent Condition D  
Data Package Generation (Note 3)  
NOTES:  
1. Visual inspection is performed to MIL-STD-883 Method 2010, Alternate Condition B.  
2. These steps are optional, and should be listed on the purchase order if required.  
3. Data Package Contents:  
o
o
o
Test Attributes (including Group A) -55 C, +25 C, +125 C  
Radiation Testing Certificate of Conformance  
4. Group B, C and D data package contains Attributes Data only.  
Spec Number 518022  
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