HGTD3N60C3, HGTD3N60C3S
TO-251AA
3 LEAD JEDEC TO-251AA PLASTIC PACKAGE
E
H
1
A
A
1
TERM. 4
SEATING
PLANE
INCHES
SYMBOL
A
A
1
b
b
1
b
2
MIN
0.086
0.018
0.028
0.033
0.205
0.018
0.270
0.250
MAX
0.094
0.022
0.032
0.040
0.215
0.022
0.290
0.265
MILLIMETERS
MIN
2.19
0.46
0.72
0.84
5.21
0.46
6.86
6.35
MAX
2.38
0.55
0.81
1.01
5.46
0.55
7.36
6.73
NOTES
-
3, 4
3, 4
3
3, 4
3, 4
-
-
5
5
-
6
-
2
b
2
D
b
1
L
1
L
c
D
E
b
1
2
3
c
e
e
1
0.090 TYP
0.180 BSC
0.035
0.040
0.355
0.075
0.045
0.045
0.375
0.090
2.28 TYP
4.57 BSC
0.89
1.02
9.02
1.91
1.14
1.14
9.52
2.28
e
e
1
LEAD 1
LEAD 2
LEAD 3
TERM. 4
- GATE
- COLLECTOR
- EMITTER
- COLLECTOR
J
1
H
1
J
1
L
L
1
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-251AA outline dated 9-88.
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 10-95.
7
HARRIS [ HARRIS CORPORATION ]
