HC5520
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
N44.65 (JEDEC MS-018AC ISSUE A)
44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
0.042 (1.07)
0.056 (1.42)
0.004 (0.10)
C
PIN (1) IDENTIFIER
0.025 (0.64)
0.045 (1.14)
0.050 (1.27) TP
INCHES MILLIMETERS
MIN
R
C
L
SYMBOL
MAX
0.180
0.120
0.695
0.656
0.319
0.695
0.656
0.319
MIN
4.20
MAX
4.57
NOTES
A
A1
D
0.165
0.090
0.685
0.650
0.291
0.685
0.650
0.291
-
2.29
3.04
-
D2/E2
17.40
16.51
7.40
17.65
16.66
8.10
-
C
L
D1
D2
E
3
E1
E
4, 5
D2/E2
17.40
16.51
7.40
17.65
16.66
8.10
-
VIEW “A”
E1
E2
N
3
4, 5
6
0.020 (0.51)
MIN
44
44
D1
D
A1
A
Rev. 1 3/95
SEATING
PLANE
0.020 (0.51) MAX
3 PLCS
-C-
0.026 (0.66)
0.032 (0.81)
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
0.045 (1.14)
MIN
VIEW “A” TYP.
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allow-
able mold protrusion is 0.010 inch (0.25mm) per side.
-C-
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
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Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to make changes in circuit design and/or specifications at
any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris is
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