GUF30A THRU GUF30M
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
VOLTAGE:50 TO 1000V
CURRENT: 3.0A
DO-201AD
FEATURE
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.2µA
Low power loss, high efficient
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated)
GUF
30A
50
GUF
30B
100
GUF
30D
200
GUF
30F
300
GUF
30G
400
GUF
30J
600
GUF
30K
800
GUF
30M
1000
SYMBOL
units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Vrrm
Vrms
Vdc
V
V
V
35
50
70
140
200
210
300
280
400
420
600
560
800
700
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
100
1000
If(av)
Ifsm
Vf
3.0
150
1.4
A
A
1.1
1.7
V
Current and 25°C
Maximum full load reverse current full cycle
average at 55°C Ambient
Ir(av)
100
µA
5
µA
µA
Maximum DC Reverse Current
at rated DC blocking voltage
Ta =25°C
Ta =125°C
Ir
50
Maximum Reverse Recovery Time (Note 1)
Trr
Cj
50
17
40
75
15
50
nS
pF
Typical Junction Capacitance
Typical Thermal Resistance
(Note 2)
(Note 3)
R(ja)
Tstg, Tj
°C /W
°C
Storage and Operating Temperature Range
-65 to +175
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
3. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A5
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GULFSEMI [ GULF SEMICONDUCTOR ]
