Global Mixed-mode Technology Inc.
G910/G911
(Note 1)
(Note 1)
Absolute Maximum Ratings
Operating Conditions
Input Voltage………………………………………….10V
Input Voltage…………………………..…..………4V ~ 7V
Temperature Range………………….….0°C ≤ TJ ≤125°C
Power Dissipation Internally Limited
(Note2)
Maximum Junction Temperature…………………150°C
Storage Temperature Range..……-65°C ≤ TJ ≤+150°C
Lead Temperature, Time for Wave Soldering
SOT89, SOT223, µTO92 Package……..…...260°C, 4s
Continuous Power Dissipation (TA = + 25°C)
SOT 89(1)………………………….…………………..0.5W
SOT 223(1)……………………….……………………0.8W
µTO 92 & TO 92 (1)…………….……………………..0.5W
Note (1): See Recommended Minimum Footprint.
Electrical Characteristics
VIN =5V, IO = 400mA/250mA+, CIN=10µF, COUT =10µF. All specifications apply for TA = TJ = 25°C.[Note 3]
PARAMETER
Output Voltage
Line Regulation
Load Regulation
CONDITIONS
MIN
TYP MAX UNITS
5mA < IO <400mA
5mA < IO <250mA+
3.234
3.3
3.366
V
4V < VIN < 7V, IO = 10mA
10
42
28
30
60
45
mV
mV
10mA < IO < 400mA
10mA < IO <250mA+
Output Impedance
Quiescent Current
Ripple Rejection
100mA DC and 100mA AC, fO = 120Hz
VIN = 5V
102
mΩ
mA
dB
0.6
fi = 120 Hz, 1VP-P, Io = 100mA
IO = 400mA
42
0.65
0.35
V
Dropout Voltage
IO =250mA+
IO = 50mA
50
100
mV
VIN = 4.5V, mounted on SOT 89 rec-
ommended minimum footprint
Continuous Test
400
Output Current
TA = 25°C, TJ < 125°C,
mA
V
IN = 5.2V, µTO 92 & TO 92 package
250+
VOUT within ±2% (Note 2)
0.53 inch leads soldered to PC Board
Short Circuit Current
Over Temperature
0.77
125
A
°C
[+ for µTO-92 & TO-92 Package]
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed speci-
fications and test conditions see the Electrical Characteristics.
Note 1:
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resis-
tance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is
Note2:
T
jmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal
shutdown. For the G910 in SOT 89 package & µTO 92,TO 92, θJA is 250°C/W and in the SOT-223 package is
156°C/W (See Recommended Minimum Footprint). The safe operation in SOT 89,µTO 92,TO 92 & SOT 223
package, it can see “Typical Performance Characteristics” (Safe Operating Area).
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
Note3:
Note4:
Load Regulation
Definitions
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input volt-
age. The measurement is made under conditions of low
dissipation or by using pulse techniques such that av-
erage chip temperature is not significantly affected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 6.6
Sep 25, 2002
2
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
