G1431
Global Mixed-mode Technology Inc.
Package Information
C
D
L
D1
E1
E
E2
H
A2
A
A1
e
0.05
b
TSSOP-20 (FD) Package
Note:
1. JEDCE outline: MP-153 AC/MO-153 ACT (thermally enhanced variations only)
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall
not exceed 0.15 per side.
3. Dimension “E1” does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed
0.25 per side.
4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in ex-
cess of the “b” dimension at maximum material conditions. Dambar cannot be located on the lower radius of
the foot. Minimum space between protrusion and adjacent lead is 0.07mm.
5. Dimensions “D” and “E1” to be determined at datum plane “H”.
DIMENSION IN MM
DIMENSION IN INCH
SYMBOLS
MIN
-----
NOM
-----
-----
1.00
-----
-----
6.50
-----
6.40 BSC
4.40
MAX
1.20
0.15
1.05
0.30
-----
MIN
-----
NOM
-----
-----
0.039
-----
-----
MAX
0.047
0.006
0.041
0.012
-----
A
A1
A2
b
C
D
D1
E
E1
E2
e
0.00
0.80
0.19
0.20
6.40
3.90
0.000
0.031
0.007
0.008
0.252
0.154
6.60
4.40
0.256
-----
0.260
0.173
0.252 BSC
0.173
-----
0.026 BSC
0.024
-----
4.30
2.70
4.50
3.20
0.169
0.106
0.177
0.126
-----
0.65 BSC
0.60
L
θ
0.45
0º
0.75
8º
0.018
0º
0.030
8º
-----
Taping Specification
PACKAGE
Q’TY/ REEL
2,500 ea
TSSOP-20 (FD)
Feed D irection
T ypical T S S O P P ackage O rientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.3
Sep 23, 2005
13
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
