G1420
Global Mixed-mode Technology Inc.
Package Information
D
24
L
D1
E
E1
E2
1
Note 5
A2
A1
e
b
TSSOP-24 (FD) Package
NOTE:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1mm unless otherwise specified
3. Coplanarity : 0.1mm
4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Follow JEDEC MO-153
DIMENSION IN MM
DIMENSION IN INCH
SYMBOLS
MIN
-----
0.00
0.80
0.19
0.20
7.7
NOM
-----
MAX
1.20
0.15
1.05
0.30
-----
MIN
-----
NOM
-----
MAX
0.047
0.006
0.041
0.012
-----
A
A1
A2
b
-----
0.000
0.031
0.007
0.008
0.303
0.173
-----
1.00
0.039
-----
-----
C
-----
-----
D
7.8
7.9
0.307
-----
0.311
0.193
D1
E
4.4
-----
4.9
6.40 BSC
4.40
0.252 BSC
0.173
-----
E1
E2
e
4.30
2.7
4.50
3.2
0.169
0.106
0.177
0.126
-----
0.65 BSC
0.60
0.026 BSC
0.024
-----
L
0.45
0º
0.75
8º
0.018
0º
0.030
8º
θ
-----
Taping Specification
PACKAGE
Q’TY/REEL
TSSOP-24 (FD)
2,500 ea
Feed Direction
Typical TSSOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.5
Aug 04, 2005
20
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
