Global Mixed-mode Technology Inc.
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . . .150°C
Reflow Temperature (soldering, 10sec) . . . . . . 260°C
Thermal Resistance Junction to Ambient, (θ
JA
)
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . .116°C/W
Thermal Resistance Junction to Case, (θ
Jc
)
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21°C/W
Note
(1)
: See Recommended Minimum Footprint
G1117
Absolute Maximum Ratings
(Note 1)
(V
IN
-V
ADJ
) Voltage. . . . . . . . . . . . . . . . . . . . . .2.5V~6.5V
Temperature Range. . . . . . . . . . . . . .-40°C
≤
T
A
≤85°C
Operating Conditions
Electrical Characteristics
Operating Conditions: V
IN
≤
6.5V, T
J
= 25°C unless otherwise specified. [Note3]
PARAMETER
Reference Voltage
Line Regulation
Load Regulation
Dropout Voltage
Current Limit
Adjust Pin Current Change
Minimum Load Current
Quiescent Current
Ripple Rejection
CONDITIONS
V
IN
- V
OUT
= 2V, I
OUT
= 10mA
(V
OUT
+ 1.5V) < V
IN
< 6.5V, I
OUT
= 10mA
(V
IN
- V
OUT
) = 2V, 10mA < I
OUT
< 1A
ΔV
OUT
= 2%, I
OUT
= 800mA
ΔV
OUT
= 2%, I
OUT
= 1A
(V
IN
- V
OUT
) = 2V
V
IN
- V
OUT
= 2V, 10mA < I
OUT
< 1A
1.5V < (V
IN
- V
OUT
) < 5.25V
V
IN
- V
OUT
= 2V
f = 120Hz, C
OUT
= 10μF Tantalum,
(V
IN
- V
OUT
) = 3V, I
OUT
= 800mA
T
A
= 25°C, 30ms pulse
V
IN
= 4V, I
O
=10mA
T
A
= 25°C, 10Hz < f < 10kHz, I
LOAD
= 10mA
MIN
1.225
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---
1000
---
10
30
---
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TYP
1.250
1.32
0.04
1.2
1.3
1200
0.15
---
80
50
0.004
0.3
0.007
116
150
10
MAX
1.275
---
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1.3
1.4
---
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---
150
---
0.02
---
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---
UNITS
V
%
%
V
mA
µA
mA
µA
dB
%/W
%
%
°C/W
°C
°C
Thermal Regulation
Temperature Stability
RMS Output Noise (% of V
OUT
)
Thermal Resistor Junction-to-Ambient
SOT-223; Recommended Minimum Footprint
(No heat sink; No air flow)
Thermal Shutdown
Junction Temperature
Thermal Shutdown Hysteresis
Note1:
Note2:
Note3:
Note4:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal resistance,
θ
JA
,
and ambient temperature T
A
. The maximum allowable power dissipation at any ambient temperature is T
jmax
-T
A
/
θ
JA
. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G1117 in SOT-223 package;
θ
JA
is 116°C/W (See recommend minimum footprint).
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
Ver: 1.9
Mar 07, 2007
TEL: 886-3-5788833
http://www.gmt.com.tw
2
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
