Device Selection Guide
High Brightness Lamps
Color
Part Number
GHB-3M45-R
GHB-3M60-R
GHB-3M60-Y
Note:
1. 2q
1
/
2
is the off axis angle where the luminous intensity is
1
/
2
the on axis intensity.
Package
Tinted
Diffused
Luminous Intensity,
Min. Iv @ 20 mA
Viewing Angle,
2
q
1
/
2
A1InGaP
DC Forward Current
[1]
Reverse Voltage
(Ir = 100
mA)
Junction Temperature,
T
jmax
Storage Temperature
Range
Operating Temperature
Range
Lead Soldering
Temperature
[1.6 mm (0.063 in.)
from seating plane]
[2,3]
5
110
-40 to +85
-20 to +85
-40 to +85
mA
V
°C
°C
°C
A) DIP/DRAG Soldering: 260
°C
for 5 seconds
B) Wave Solder Temperature: 245
°C
for 3 seconds
Notes:
1. See Page 3 for maximum current derating vs. ambient temperature.
2. Suggested minimum DC current: 10 mA
3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.
Electrical Characteristics at T
Forward
Voltage
Vf (Volts)
Part Number
GHB-3M60-Y
GHB-3M45/60-R
Typ.
Max.
A
= 25 ¼C
Capacitance
C (pF)
Vf = 0,
f = 1 MHz
Typ.
Speed of Response
t
s
(ns)
Time Constant
e
-t
/t
s
Typ.
If (mA)
Thermal
Resistance R
q
J-PIN
(
°
C/W)
Optical Characteristics at T
A
= 25 ¼C
Typ. Dominant
Typ. Peak
Wavelength
Wavelength (nm)
(nm)
Luminous
Efficacy
Width
(lm/W)
Luminous Intensity
Part Number
GHB-3M45-R
GHB-3M60-R
GHB-3M60-Y
Min.
If (mA)
Typ. Spectral
Half Width