3. Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was performed
using the maximum Pb-free reflow profile shown in Figure 3-1.The recommended
standard Pb reflow profile is shown in Figure 3-2.
Temperature
60-150 sec.
20-40 sec.
260°C
250°C
3°C/sec max
217°C
6°C/sec max
200°C
150°C
25°C
Time
60-180 sec. max
8 min. max
Figure 3-1: Maximum Pb-free Solder Reflow Profile (Preferred)
60-150 sec.
Temperature
10-20 sec.
230°C
220°C
3°C/sec max
183°C
6°C/sec max
150°C
100°C
25°C
Time
120 sec. max
6 min. max
Figure 3-2: Standard Pb Reflow Profile (Pb-free package)
GS1578A HD-LINX® II Multi-Rate Dual Slew-Rate
7 of 16
Cable Driver
Data Sheet
Proprietary & Confidential
33657 - 5
November 2009
GENNUM [ GENNUM CORPORATION ]
