7.2 Packaging Data
Parameter
Value
Package Type
14mm x 14mm 80-pin LQFP
Package Drawing Reference
Moisture Sensitivity Level
Junction to Case Thermal Resistance, θj-c
JEDEC MS026
3
11.6°C/W
Junction to Air Thermal Resistance, θj-a (at zero airflow)
39.9°C/W
Psi
0.6°C/W
Pb-free and RoHS Compliant
Yes
7.3 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. The recommended standard
eutectic reflow profile is shown in Figure 7-1. MSL qualification was performed using
the maximum Pb-free reflow profile shown in Figure 7-2.
60-150 sec.
Temperature
10-20 sec.
230°C
220°C
3°C/sec max
183°C
6°C/sec max
150°C
100°C
25°C
Time
120 sec. max
6 min. max
Figure 7-1: Standard Eutectic Solder Reflow Profile
GS1560A/GS1561 HD-LINX® II Dual-Rate Deserializer
Data Sheet
77 of 79
27360 - 12
June 2009
GENNUM [ GENNUM CORPORATION ]
