5. Package Dimensions
8 SOIC
D
X
Min.
0.054
0.004
0.014
0.189
0.150
0.229
Max.
A
0.068
0.0098
0.019
0.196
0.157
0.244
A1
B
E
0.010
Gauge Plane
Seating Plane
D
E
q2
Pin 1
L
ID Mark
e
B
DETAIL “A”
H
e
0.050 BSC
DETAIL “A”
0.015 0.004 x 45°
C
0.0075
0.0098
0.034
0.016
L
C
q1
0.0215 REF
8°
X
q1
q2
A
A1
0°
7° BSC
NOTES:
1. All dimensions in inches unless otherwise stated.
2. Lead coplanarity should be 0 to 0.004” max.
3. Package surface finishing: VDI 24~27 (dual).
Package surface finishing: VDI 13~15 (16L SOIC[NB] matrix).
4. All dimensions exclude mold flashes.
5. The lead width (B) to be determined at 0.0075”
from the lead tip.
Figure 5-1: Package Dimensions
5.1 Ordering Information
Part Number
Package
Temperature
Pb-Free and RoHS Compliant
GS1528-CKAE3
GS1528-CTAE3
8 pin SOIC
0°C to 70°C
0°C to 70°C
Yes
Yes
8 pin SOIC, tape & reel
(250pc)
GS1528-CTAE3Z
8 pin SOIC, tape & reel
(2,500pc)
0°C to 70°C
Yes
GS1528 HD-LINX II Multi-Rate SDI Dual Slew-Rate
12 of 13
Cable Driver
Data Sheet
16632 - 9
August 2010
GENNUM [ GENNUM CORPORATION ]
