GL422/GL423 USB 2.0 +SD/MMC-controller Combo Solution
MMC mode: HDATA6 from/to
35
36
37
PAD_HDATA6
PAD_UDATA7
PAD_HDATA7
B
B
B
HOST.
(Double Bonding)
MMC mode: HDATA7 from/to USB
reader.
(Double Bonding)
MMC mode: HDATA7 from/to
HOST.
NC
G5
(Double Bonding)
4.6.4 Flash Interface
The flash interface is used to access AND/NAND flash, defined as Table 4.4. It is also shared with USB test
interface, refers to Table 4.7.
Table 4.4 – Flash Interface
QFN56 VFBGA
Pin#
54
Pin Name Pad#
Pad Name
Type
Description
Pin#
‘0’ for FLASH chip 0 to select active
(low-active).
31
32
C4
B4
CE0_
CE1_
65
66
PAD_CE0_B
PAD_CE1_B
B
B
‘0’ for FLASH chip 1 to select active
(low-active).
33
34
30
35
A5
F3
CLE
ALE
RE_
WE_
67
68
64
69
PAD_CLE
PAD_ALE
PAD_RE_B
PAD_WE_B
B
B
B
B
FLASH command latch enable
FLASH address latch enable
FLASH read enable (low active)
FLASH write enable (low active)
FLASH ready when high, busy when
low.
B5
A4
29
C5
BUSY_
63
PAD_BUSY_B
B
NC
19
20
21
22
B3
G4
F4
WP_
DA0
DA1
DA2
DA3
71
44
45
46
47
PAD_WP_B
PAD_DA0
PAD_DA1
PAD_DA2
PAD_DA3
B
B
B
B
B
FLASH write protect (low active)
FLASH bus bit0
FLASH bus bit1
D6
E5
FLASH bus bit2
FLASH bus bit3
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