FTR-H1 SERIES
RoHS Compliance and Lead Free Relay Information
1. General Information
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.
All signal and most power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
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“LF” is marked on each outer and inner carton. (No marking on individual relays).
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
We will ship leaded relays as long as the leaded relay inventory exists.
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Profile
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Recommended solder paste Sn-3.0Ag-0.5Cu.
Reflow Solder condtion
Flow Solder condtion:
Pre-heating:
Soldering:
maximum 120˚C
dip within 5 sec. at
260˚C soler bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
4. Tin Whisker
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Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in
house test.
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