FAR Family (C1, C3, C4 series)
■ STANDARD FREQUENCY
C1/C3 series
C4 series
Standard
frequency (kHz)
Package
size
Resonant
resistance
Package
size
Resonant
resistance
3,580
4,000
4,194
4,915
A
A
A
A
A
A
A
A
300 Ω max.
150 Ω max.
(00)
(01)
6,000
6,144
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
7,373
8,000
10,000
11,000
11,059
12,000
14,746
16.000
150 Ω max.
75 Ω max.
(01)
(02)
•
Package sizes and resonant resistance
There are two package sizes according to frequency:
Frequency
3 to 5.99 MHz
6 to 16 MHz
Package size
A
B
For resonant resistance, standard values are specified according to frequency:
Standard resonant resistance
Frequency
C1/C3 series
C4 series
300 Ω max.
3 to 3.57 MHz
3.58 to 5.99 MHz
6 to 16 MHz
—
(00)
300 Ω max.
150 Ω max.
(00)
(01)
150 Ω max.
75 Ω max.
(01)
(02)
Note: For resonant resistance other than the standard values, they are specified by Fujitsu considering matching data with
applied IC (mainly micro computer).
■ NOTES ON USE
•
•
Handle carefully.
Solder under the following conditions.
CHIP type: 5 seconds max. at 230°C (PCB)
SIP type: 10 seconds max. at 260°C
Do not apply extreme heat to the resonator. Recommended preheating for the CHIP type is 150°C for one
minute.
•
•
•
•
Avoid extreme fluctuations in temperature during use.
There is no specific direction in resonator mounting.
Additional information is available separately, if required, for designing microcomputer oscillation circuits.
CHIP type is for reflow solder, not for flow solder.
3
FUJITSU [ FUJITSU ]
