0.25µm CMOS Technology
PACKAGE AVAILABILITY
No. of Pins
100
120
144
176
208
256
176
208
240
208
240
256
304
256
352
420
576
672
144
176
224
288
304
352
480
560
660
720
K1, K2
K2, K3
K3, K4, K8, T2, T3
K4, K5, T3, T4
T4, T5, T6, T7, T8, T9
T8, T9, TA, TB, TC
J1, J2, K4, K5
J3, J4, J5, K5, K6, K7, K8
J4, J5, J6, K6, K7, K8
J3, J4, J5, J6, J7, J8, J9, K5, K6, K7, K8
T4, T5, T6, T7, T8, T9
J4, J5, J6, J7, J8, J9, JA, K6, K7, K8, T6, T7, T8, T9, TA
J5, J6, J7, J8, J9, T7, T8, T9, TA, TB, TC
J7, J8, J9, JA, JB, JC, JD, JE, JF, JG, TB, TC, TD, TE, TG
J3, J4, T7, T8, T9, TA, TB
J6, J7, J8, TB, TC, TD
J8, J9, TD, TE
JA, JB
JC, JD
T3
T3, T4
T5, T6, T7, T8, T9
T8, T9, TA, TB, TC
L4, L5
L5, L6, L7
L6, L7
L7, L8, LB, LC
L8, L9
L9, LA, LB, LC, LD, LE
Frame Size
Thin and Low Profile QFP Packages (0.4, 0.5 mm lead pitch)
Shrink QFP Package (0.5 mm lead pitch)
Heatspreader QFP Package (0.4, 0.5 mm lead pitch)
Ball Grid Array (1.27 mm ball pitch)
Fine-Pitch Ball Grid Array (0.75, 0.8 mm ball pitch)
Tab Ball Grid Array (0.8, 1.0 mm ball pitch)
Fujitsu Microelectronics, Inc.
FUJITSU [ FUJITSU COMPONENT LIMITED. ]
