FTR-B4 Series
n DIMENSIONS
AND SCHEMATICS
Reduced mounting area
5.7
±0.3
10.6
±0.3
9
±0.3
0.5
0.4
±0.1
1.5
±0.2
3.2
±0.2
2.2
±0.2
2.2
±0.2
0.2
±0.05
3.2
±0.3
5.7
±0.3
3.2
7.6
2.2
(-)
8
7
6
5
2.25
2.25
4.45
0.8
1
(+)
2
1.2
3
9.7
±0.3
4
Recommended mounting pad
(Tolerance: ±0.1mm)
Terminal designations
(Top view de-energized
position)
n RECOMMENDED
SOLDERING CONDITIONS
(TEMPERATURE PROFILE)
IRS (Infrared Reflow Soldering)
Temperature (C)
T
3
T
2
T
1
preheating
soldering
T
3
= 245C max.
T
2
= 200C max.
cooling T
1
= 165C max.
Note:
1.Temperature profiles show the tempera
ture of PC board surface.
2. Please perform soldering test with your
actual PC board before mass produc
tion, since the temperatures of PC
board surfaces vary according to the
size of PC board, status of parts mount
ing and heating method.
0
120 sec maximum
30 sec
Max.
n PRECAUTIONS
- For details on general precautions, refer to the section on technical descriptions.
- Since this is a polar relay, follow the instructions of the internal wiring diagram for the +- connections of the coil.
- Note that the terminal array and internal wiring of the surface mount relay are a top view.
7
FUJITSU [ FUJITSU COMPONENT LIMITED. ]
