Sensing element／Differential
FDM Data sheet
Reflow Soldering process recommendation profile
Package
Surface
Temperature
(Degree C)
230
210
150
Room
Temp.
Time
a
b
c
d
e
a: Rump up rate
b: Pre-heating
c: Rump up rate
d: Heating
1 or 2 deg.C/sec.
150 to 180 deg.C,within 60 to120sec.
1 to 2 deg.C/sec.
max.230 deg.C,max.10sec. 210 deg.C,within 30sec.
1 or 2 deg.C/sec.
e: Rump down rate
Note ;
1 ) Temperature means Surface temperature of the sensor package.
2 ) Reflow process max. 2 times.
3 ) Do not wash the sensor.
4 ) Do not put the solder and flux on the sensor package.
If you have any questions regarding technical issues or specifications, please contact us.
Fujikura Ltd. Sensor Department
Phone +81-(0)3-5606-1072
5-1 Kiba 1-chome, Koto-ku, Tokyo 135-8512, Japan
E-mail : sensor@fujikura.co.jp
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FUJIKURA [ FUJIKURA LTD. ]
