Datasheet
Vinculum-II Embedded Dual USB Host Controller IC
Version 1.7
Document No.: FT_000138 Clearance No.: FTDI#143
11Package Parameters
VNC2 is available in six RoHS Compliant packages, three QFN packages (64QFN, 48QFN & 32QFN) and
three LQFP packages (64LQFP, 48LQFP & 32LQFP). All packages are lead (Pb) free and use a ‘green’
compound. The packages are fully compliant with EuropeanUnion directive 2002/95/EC.
The mechanical drawings of all six packages are shown in sections 11.2 to 11.7– all dimensions are in
millimetres.
The solder reflow profile for all packages can be viewed in Section 11.8.
11.1 VNC2 Package Markings
An example of the markings on each package is shown in Figure 11.1. The FTDI part number is too long
for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line as
shown in Figure 11.2.
Line 1 – FTDI Logo
FTDl
Line 2 – Wafer Lot Number
XXXXXXXXXX
Line 3 – FTDI Part Number
including revision. In this case it shows Rev
VNC2-64Q1A
A. Please check for most recent revision.
Line 4 - Date Code
YYWW
YY - year year
WW - work week
Figure 11.1 Package Markings
FTDl
XXXXXXXXXX
VNC2-32Q
1A YYWW
Figure 11.2 Markings – 32 QFN
The last letter of the FTDI part number is the silicon revision number. This may change from A to B to C,
etc.,. Please check the part number for the most recent revision.
73
Copyright © Future Technology Devices International Limited
FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
