FT51A Advanced MCU with 8051 Compatible Core IC Datasheet
Version 1.5
Document No.: FT_000877
Clearance No.: FTDI#420
7.5 Solder Reflow Profile
The FT51A is supplied in a Pb free package. The recommended solder reflow profile is shown in Figure
7-9 FT51A Solder Reflow Profile.
tp
T
p
Critical Zone: when
T is in the range
Ramp Up
T to T
p
L
T
L
tL
T Max
S
Ramp
Down
T Min
S
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 7-9 FT51A Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Error! Reference source not
found.. Values are shown for both a completely Pb free solder process (i.e. the FT51A is used with Pb
free solder), and for a non-Pb free solder process (i.e. the FT51A is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
150°C
200°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
217°C
183°C
- Temperature (TL)
- Time (tL)
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak Temperature
(tp)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 7-1 – Reflow Profile Parameters
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