FT4232H QUAD HIGH SPEED USB TO MULTIPURPOSE UART/MPSSE IC
Datasheet
Version 2.4
Document No.: FT_000060 Clearance No.: FTDI#78
8.4 Solder Reflow Profile
tp
T
p
Critical Zone: when
T is in the range
T to T
Ramp Up
p
L
T
L
tL
T Max
S
Ramp
Down
T Min
S
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 8.4 FT4232H Solder Reflow Profile
Pb Free Solder Process
SnPb Eutectic and Pb free (non
green material) Solder Process
Profile Feature
(green material)
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
150°C
200°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
217°C
183°C
- Temperature (TL)
- Time (tL)
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
see Table 8.3
Time within 5°C of actual Peak Temperature
(tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 8.2 Reflow Profile Parameter Values
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