DS_FT311D USB ANDROID HOST IC Datasheet
Version 1.0
Document No.: FT_000660 Clearance No.: FTDI# 305
Pb Free Solder Process
SnPb Eutectic and Pb free (non
Profile Feature
green material) Solder Process
(green material)
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
150°C
200°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
217°C
183°C
- Temperature (TL)
- Time (tL)
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
see Figure 9-5
20 to 40 seconds
Time within 5°C of actual Peak Temperature
(tp)
30 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 9.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 deg C
220 +5/-0 deg C
220 +5/-0 deg C
220 +5/-0 deg C
≥ 2.5 mm
Pb Free (green material) = 260 +5/-0 deg C
Table 9.2 Package Reflow Peak Temperature
Copyright © 2012 Future Technology Devices International Limited
34
FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
