DS_FT311D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000660 Clearance No.: FTDI# 305
9 Package Parameters
FT311D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP).
The packages are lead (Pb) free and use a ‘green’ compound. The package is fully compliant with
European Union directive 2002/95/EC.
The mechanical drawings of the packages are shown in sections 9.2- all dimensions are in millimetres.
The solder reflow profile for all packages can be viewed in Section 9.3.
9.1 FT311D Package Markings
9.1.1 QFN-32
An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too
long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line.
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
XXXXXXXX
Line 3 – FTDI Part Number
FT311D-32Q
Line 4 – Revision and Date
Code
1C YYWW
32
1
Figure 9-1 QFN Package Markings
1C should be printed on line 4, then a space and then the Date Code.
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
4. All marking dimensions should be marked proportionally. Marking font should be using
Unisem standard font (Roman Simplex)
Copyright © 2013 Future Technology Devices International Limited
30
FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
