FT230X USB TO BASIC UART IC
Document No.: FT_000566 Clearance No.: FTDI# 260
Version 1.2
9.5 Solder Reflow Profile
The FT230X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
t
p
Temperature, T (Degrees C)
T
p
Ramp Up
T
L
t
L
T
S
Max
Critical Zone: when
T is in the range
T
L
to T
p
Ramp
Down
T Min
S
t
S
Preheat
25
T = 25º C to T
P
Time, t (seconds)
Figure 9.5 FT230X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT230X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT230X is used with non-Pb free solder).
Profile Feature
Average Ramp Up Rate (T
s
to T
p
)
Pb Free Solder Process
3°C / second Max.
Non-Pb Free Solder Process
3°C / Second Max.
Preheat
- Temperature Min (T
s
Min.)
- Temperature Max (T
s
Max.)
- Time (t
s
Min to t
s
Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
T
L
:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
p
)
Time within 5°C of actual Peak Temperature
(t
p
)
Ramp Down Rate
Time for T= 25°C to Peak Temperature, T
p
Table 9.1 Reflow Profile Parameter Values
217°C
60 to 150 seconds
183°C
60 to 150 seconds
260°C
240°C
20 to 40 seconds
20 to 40 seconds
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
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