LEADED (Sn/Pb) PROCESS RECOMMENDED TEMPERATURE PROFILE
Peak temp.
2nd Ramp-up temp.
210~230°C 5sec.
1.0~3.0°C /sec.
250
Pre-heat temp.
140~180°C 60~120 sec.
200
Cooling down rate <3°C /sec.
Ramp-up temp.
0.5~3.0°C /sec.
150
100
50
Over 200°C
40~50sec.
0
60
120
Time ( sec. )
180
240
300
Note: The temperature refers to the pin of E48SH, measured on the pin +Vout joint.
LEAD FREE (SAC) PROCESS RECOMMENDED TEMPERATURE PROFILE
.
Temp
Peak Temp. 240 ~ 245 ℃
217℃
200℃
Ramp down
max. 4℃/sec.
Preheat time
100~140 sec.
150℃
25℃
Time Limited 90 sec.
above 217℃
Ramp up
max. 3℃/sec.
Time
Note: The temperature refers to the pin of E48SH, measured on the pin +Vout joint.
* For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering
assembly onto system boards; please do not subject such modules through reflow temperature profile.
E48SH3R330_05142009
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