Transfer Function (MPXHZ6250A)
Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040)
± (Pressure Error x Temp Factor x 0.004 x VS)
V
S = 5.0 ± 0.36 Vdc
Temperature Error Band
MPXHZ6250A
4.0
Break Points
Temp
Multiplier
3.0
-40
0 to 85
125
3
1
1.75
Temperature
Error
Factor
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
Pressure Error Band
4.0
Error Limits for Pressure
Pressure (in kPa)
3.0
2.0
1.0
0.0
20
60
100
140
180
220
260
300
-1.0
-2.0
-3.0
-4.0
Pressure
Error (Max)
±3.45 (kPa)
20 to 250 (kPa)
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 4. SSOP Footprint (Case 1317A)
MPXHZ6250A
Sensors
Freescale Semiconductor
5
FREESCALE [ Freescale ]
