.
+5.0 V
Fluoro Silicone
Gel Die Coat
Stainless
Steel Cap
Die
P1
VS Pin 2
MPXA6115A
MPXH6115A
Vout Pin 4
Wire Bond
Thermoplastic
Case
to ADC
100 nF
Lead
Frame
47 pF
51 K
GND Pin 3
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (Not to Scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
MAX
Transfer Function:
out = Vs* (.009*P-.095) ± Error
VS = 5.0 Vdc
4.5
V
4.0
TEMP = 0 to 85ºC
3.5
3.0
2.5
TYP
2.0
1.5
1.0
0.5
0
MIN
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXA6115A/
MPXH6115A series pressure sensor operating
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85×C temperature
range. The output will saturate outside of the rated pressure
range.
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information
regarding media compatibility in your application.
MPXA6115A
Sensors
4
Freescale Semiconductor
FREESCALE [ Freescale ]
