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MPC885ZP66 参数 Datasheet PDF下载

MPC885ZP66图片预览
型号: MPC885ZP66
PDF下载: 下载PDF文件 查看货源
内容描述: 硬件规格 [Hardware Specifications]
分类和应用:
文件页数/大小: 92 页 / 1505 K
品牌: FREESCALE [ Freescale ]
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Mechanical Data and Ordering Information  
16.2 Mechanical Dimensions of the PBGA Package  
Figure 77 shows the mechanical dimensions of the PBGA package.  
NOTES:  
1. ALL DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.  
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.  
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.  
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package  
MPC885/MPC880 Hardware Specifications, Rev. 3  
88  
Freescale Semiconductor  
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