Table of Contents
1 Ordering parts...........................................................................3
5.2.8 Capacitance attributes..........................................21
5.3 Switching specifications.....................................................21
5.3.1 Device clock specifications...................................21
5.3.2 General Switching Specifications..........................22
5.4 Thermal specifications.......................................................22
5.4.1 Thermal operating requirements...........................22
5.4.2 Thermal attributes.................................................22
6 Peripheral operating requirements and behaviors....................23
6.1 Core modules....................................................................23
6.1.1 SWD Electricals ...................................................23
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1 MCG specifications...............................................25
6.3.2 Oscillator electrical specifications.........................27
6.4 Memories and memory interfaces.....................................29
6.4.1 Flash electrical specifications................................29
6.5 Security and integrity modules..........................................30
6.6 Analog...............................................................................31
6.6.1 ADC electrical specifications.................................31
6.6.2 CMP and 6-bit DAC electrical specifications.........33
6.7 Timers................................................................................35
6.8 Communication interfaces.................................................35
6.8.1 USB electrical specifications.................................35
6.8.2 USB VREG electrical specifications......................35
6.8.3 SPI switching specifications..................................36
6.8.4 I2C.........................................................................40
6.8.5 UART....................................................................40
7 Dimensions...............................................................................40
7.1 Obtaining package dimensions.........................................40
8 Pinout........................................................................................41
8.1 KL24 Signal Multiplexing and Pin Assignments................41
8.2 KL24 Pinouts.....................................................................43
9 Revision History........................................................................47
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................4
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................5
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............6
3.8 Definition: Typical value.....................................................7
3.9 Typical Value Conditions...................................................8
4 Ratings......................................................................................8
4.1 Thermal handling ratings...................................................8
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................9
5.1 AC electrical characteristics..............................................10
5.2 Nonswitching electrical specifications...............................10
5.2.1 Voltage and current operating requirements.........10
5.2.2 LVD and POR operating requirements.................11
5.2.3 Voltage and current operating behaviors..............12
5.2.4 Power mode transition operating behaviors..........13
5.2.5 Power consumption operating behaviors..............13
5.2.6 EMC radiated emissions operating behaviors.......20
5.2.7 Designing with radiated emissions in mind...........21
KL24 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
2
Freescale Semiconductor, Inc.
FREESCALE [ Freescale ]
