Table of Contents
1 Ordering parts...........................................................................3
5.4.1 Thermal operating requirements...........................20
5.4.2 Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................21
6.1 Core modules....................................................................21
6.1.1 Debug specifications.............................................21
6.2 System modules................................................................22
6.3 Clock modules...................................................................22
6.3.1 MCG specifications...............................................22
6.3.2 Oscillator electrical specifications.........................24
6.4 Memories and memory interfaces.....................................27
6.4.1 Flash (FTFL) electrical specifications....................27
6.4.2 EzPort Switching Specifications............................31
6.4.3 Mini-Flexbus Switching Specifications..................32
6.5 Security and integrity modules..........................................35
6.6 Analog...............................................................................36
6.6.1 ADC electrical specifications.................................36
6.6.2 CMP and 6-bit DAC electrical specifications.........38
6.6.3 12-bit DAC electrical characteristics.....................41
6.6.4 Voltage reference electrical specifications............44
6.7 Timers................................................................................45
6.8 Communication interfaces.................................................46
6.8.1 USB electrical specifications.................................46
6.8.2 USB DCD electrical specifications........................46
6.8.3 USB VREG electrical specifications......................46
6.8.4 SPI switching specifications..................................47
6.8.5 I2S/SAI Switching Specifications..........................51
6.9 Human-machine interfaces (HMI)......................................53
6.9.1 TSI electrical specifications...................................53
7 Dimensions...............................................................................54
7.1 Obtaining package dimensions.........................................54
8 Pinout........................................................................................55
8.1 Signal Multiplexing and Pin Assignments..........................55
8.2 Pinout diagrams.................................................................57
8.3 Module-by-module signals.................................................61
9 Revision History........................................................................72
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................5
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............6
3.8 Definition: Typical value.....................................................7
4 Ratings......................................................................................8
4.1 Thermal handling ratings...................................................8
4.2 Moisture handling ratings..................................................8
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................9
5.1 Typical Value Conditions...................................................9
5.2 Nonswitching electrical specifications...............................10
5.2.1 Voltage and Current Operating Requirements......10
5.2.2 LVD and POR operating requirements.................11
5.2.3 Voltage and current operating behaviors..............12
5.2.4 Power mode transition operating behaviors..........12
5.2.5 Power consumption operating behaviors..............13
5.2.6 EMC radiated emissions operating behaviors.......17
5.2.7 Designing with radiated emissions in mind...........18
5.2.8 Capacitance attributes..........................................18
5.3 Switching electrical specifications.....................................18
5.3.1 General Switching Specifications..........................18
5.4 Thermal specifications.......................................................20
MCF51JU128 Data Sheet, Rev. 4, 01/2012.
2
Freescale Semiconductor, Inc.
FREESCALE [ Freescale ]
