System Design Information
9.8 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat
sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to
the package by several methods—spring clip to holes in the printed-circuit board or package, and mounting clip and
screw assembly (see Figure 27); however, due to the potential large mass of the heat sink, attachment through the
printed-circuit board is suggested. If a spring clip is used, the spring force should not exceed 10 pounds.
CBGA Package
Heat Sink
Heat Sink
Clip
Thermal Interface Material
Printed-Circuit Board
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7455. There are several
commercially available heat sinks for the MPC7455 provided by the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
408-749-7601
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
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Freescale Semiconductor
FREESCALE [ Freescale ]
