Package Description
8.3 Substrate Capacitors for the MPC7445, 360 CBGA
Figure 21 shows the connectivity of the substrate capacitor pads for the MPC7445, 360 CBGA. All capacitors are
100 nF.
A1 Corner
C4-2
C4-1
C5-2
C5-1
C6-2
C6-1
Pad Number
Capacitor
-1
OV
-2
C1
C2
C3
C4
C5
C6
GND
GND
GND
GND
GND
GND
DD
DD
DD
V
DD
OV
V
DD
OV
V
DD
C3-2
C3-1
C2-2
C2-1
C1-2
C1-1
Figure 21. Substrate Bypass Capacitors for the MPC7445, 360 CBGA
8.4 Package Parameters for the MPC7455, 483 CBGA
The package parameters are as provided in the following list. The package type is 29 × 29 mm, 483-lead ceramic
ball grid array (CBGA).
Package outline
Interconnects
29 × 29 mm
483 (22 × 22 ball array – 1)
1.27 mm (50 mil)
—
Pitch
Minimum module height
Maximum module height
Ball diameter
3.22 mm
0.89 mm (35 mil)
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
43
FREESCALE [ Freescale ]
