Package Description
8.2 Mechanical Dimensions for the MPC7445, 360 CBGA
Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7445, 360 CBGA
package.
2X
0.2
D
B
Capacitor Region
D1
A
A1 CORNER
0.15 A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
E3
E
E2
E1
Millimeters
DIM
MIN
MAX
2X
0.2
A
A1
A2
A3
b
2.72
0.80
1.10
—
3.20
1.00
1.30
0.6
D2
C
171819
1
2
3
4
5
6
7
8
9 10 111213141516
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
0.82
0.93
A3
D
25.00 BSC
D1
D2
e
—
6.15
A2
A1
12.15
12.45
1.27 BSC
25.00 BSC
A
E
E1
E2
E3
—
11.1
7.45
8.75
—
e
360X
b
9.20
0.3 A B C
A
0.15
Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7445,
360 CBGA Package
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
42
Freescale Semiconductor
FREESCALE [ Freescale ]
