MAP-BGA Package Mechanical Drawing
3.4 MAP-BGA Package Mechanical Drawing
Notes:
1. Dimensions are in millimeters.
2. Interpret dimensions and
tolerances per ASME Y14.5M,
1994.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to datum plane Z.
4. Datum Z (seating plane) is
defined by the spherical crowns
of the solder balls.
5. Parallelism measurement shall
exclude any effect of mark on
top surface of package.
Millimeters
DIM MIN MAX
1.6
A
1.9
A1 0.50 0.70
A2 1.16 REF
b
D
E
e
0.60 0.90
21.00 BSC
21.00 BSC
1.27 BSC
Figure 3-6. DSP56301 Mechanical Information, 252-pin MAP-BGA Package
DSP56301 Technical Data, Rev. 10
Freescale Semiconductor
3-23
FREESCALE [ Freescale ]
