Table of Contents
1 Ordering parts...........................................................................4
5.2.1 Control timing........................................................13
5.2.2 Debug trace timing specifications.........................14
5.2.3 FTM module timing...............................................15
5.3 Thermal specifications.......................................................16
5.3.1 Thermal characteristics.........................................16
6 Peripheral operating requirements and behaviors....................17
6.1 External oscillator (XOSC) and ICS characteristics...........17
6.2 NVM specifications............................................................19
6.3 Analog...............................................................................20
6.3.1 ADC characteristics...............................................20
6.3.2 Analog comparator (ACMP) electricals.................23
6.4 Communication interfaces.................................................24
6.4.1 SPI switching specifications..................................24
7 Dimensions...............................................................................27
7.1 Obtaining package dimensions.........................................27
8 Pinout........................................................................................28
8.1 Signal multiplexing and pin assignments...........................28
8.2 Device pin assignment......................................................31
9 Revision history.........................................................................34
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Parameter Classification...........................................................5
4 Ratings......................................................................................5
4.1 Thermal handling ratings...................................................5
4.2 Moisture handling ratings..................................................6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings...............................6
5 General.....................................................................................7
5.1 Nonswitching electrical specifications...............................7
5.1.1 DC characteristics.................................................7
5.1.2 Supply current characteristics...............................12
5.1.3 EMC performance.................................................13
5.2 Switching specifications.....................................................13
MC9S08PA60 Series Data Sheet, Rev. 1, 10/9/2012.
Freescale Semiconductor, Inc.
3
FREESCALE [ Freescale ]
